JOB DETAILS
Principal SoC Chip Lead
CompanyNXP Semiconductors
LocationShanghai
Work ModeOn Site
PostedAugust 4, 2026
About The Company
We anticipate tomorrow’s needs—navigating a changing world by bringing together technology's brightest minds to build game-changing solutions that propel us forward.
NXP Semiconductors N.V. (NASDAQ: NXPI) is the trusted partner for innovative solutions in the automotive, industrial & IoT, mobile, and communications infrastructure markets. NXP's "Brighter Together" approach combines leading-edge technology with pioneering people to develop system solutions that make the connected world better, safer, and more secure. The company has operations in more than 30 countries and posted revenue of $12.61 billion in 2024. Find out more at www.nxp.com.
Career Development Opportunities : Bright Minds. Bright Futures.
We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills.
Commitment At NXP.
We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress. Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality.
Privacy Policy: https://www.nxp.com/company/about-nxp/privacy-policy-for-social-media-pages:PRIVACY-POLICY-SOCIAL-MEDIA
About the Role
Responsibilities:
- End-to-End Project Ownership: Own SoC program execution from project definition through tape-out and post-silicon support. Ensure on-time, high-quality delivery of key milestones and coordinate engineering support during silicon bring-up, validation, and debug.
- Technical Leadership: Drive technical decision-making across architecture, integration, verification, implementation, validation, and system teams. Serve as the overall technical execution owner for assigned projects.
- Cross-Functional Coordination: Lead and align Architecture, RTL, DFT, Verification, Emulation, Physical Design, AMS, IP, and related engineering teams. Resolve technical dependencies, execution bottlenecks, and critical project risks.
- Program Execution & Risk Management: Develop and maintain project execution plans together with PMO and SoC PM. Monitor schedule, resource demand, critical paths, and risk mitigation plans; drive recovery actions when milestones are at risk.
- Stakeholder Management: Partner with Product Marketing, System Architecture, System Engineering, NPI PM, BU management, and external stakeholders. Communicate project status, technical readiness, key risks, and mitigation plans during management and milestone reviews.
- Tape-Out & Silicon Readiness: Own overall tape-out readiness, including integration quality, signoff closure, cross-functional alignment, and risk management. Coordinate post-silicon validation activities and engineering resources to support silicon bring-up and issue resolution.
Requirements:
- Bachelor's degree or higher in Microelectronics, Electrical Engineering, or related disciplines.
- 6+ years of semiconductor industry experience.
- Proven experience in SoC development from architecture through tape-out.
- Strong understanding of SoC development flows including: Architecture, RTL Design, Integration, Verification, DFT, Emulation, Physical Design, Silicon Validation.
- Experience leading large cross-functional engineering teams.
- Strong project execution, planning, and risk management skills.
- Excellent communication, leadership, and stakeholder management capabilities.
- Ability to influence technical direction and drive execution in a matrix organization.
Preferred Qualifications:
- Previous experience as: Chip Lead / SoC Technical Lead / Chief Engineer / Project Technical Leader
- Experience with automotive, industrial, or safety-critical semiconductor products.
- Experience working with global development teams across multiple sites.
- Successful delivery of multiple SoC tape-outs and post-silicon product ramps.
Core Competencies:
- Technical Leadership
- Cross-functional Collaboration
- Project Execution Excellence
- Risk Management
- Strategic Thinking
- Problem Solving & Decision Making
- Stakeholder Management
- Communication & Influence
- Customer Focus
- Results Orientation
Key Skills
SoC DevelopmentTechnical LeadershipProject ManagementRTL DesignVerificationPhysical DesignDFTSilicon ValidationRisk ManagementStakeholder ManagementCross-functional CoordinationArchitectureEmulationTape-outSystem EngineeringProblem Solving
Categories
EngineeringTechnologyManagement & LeadershipManufacturing
Job Information
📋Core Responsibilities
The Principal SoC Chip Lead will own the end-to-end execution of SoC programs from project definition through tape-out and post-silicon support. They will provide technical leadership across cross-functional teams to ensure high-quality delivery and effective risk management.
📋Job Type
full time
📊Experience Level
5-10
💼Company Size
22538
📊Visa Sponsorship
No
💼Language
English
🏢Working Hours
40 hours
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