JOB DETAILS
External Package Innovation Engineer
CompanyNXP Semiconductors
LocationKuala Lumpur
Work ModeOn Site
PostedAugust 5, 2026
About The Company
We anticipate tomorrow’s needs—navigating a changing world by bringing together technology's brightest minds to build game-changing solutions that propel us forward.
NXP Semiconductors N.V. (NASDAQ: NXPI) is the trusted partner for innovative solutions in the automotive, industrial & IoT, mobile, and communications infrastructure markets. NXP's "Brighter Together" approach combines leading-edge technology with pioneering people to develop system solutions that make the connected world better, safer, and more secure. The company has operations in more than 30 countries and posted revenue of $12.61 billion in 2024. Find out more at www.nxp.com.
Career Development Opportunities : Bright Minds. Bright Futures.
We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills.
Commitment At NXP.
We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress. Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality.
Privacy Policy: https://www.nxp.com/company/about-nxp/privacy-policy-for-social-media-pages:PRIVACY-POLICY-SOCIAL-MEDIA
About the Role
Hiring: External Package Innovation Engineer
We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution.
🔹 Role Overview
As an EPI engineer, you will act as both a Role Owner and Key Supporter for OSAT-related development activities, ensuring robust execution from concept through production.
🔹 Key Responsibilities
✅ 1. Role Owner (Strategic & Governance)
- Own and lead OSAT-wide and cross-OSAT initiatives
- Define and deploy standard development templates and success criteria across OSATs
- Drive deployment of Best Known Methods (BKM) and lessons learned
- Develop and maintain technology roadmap and capability assessment for each OSAT site
- Provide Package Innovation (PI) input for:
- External site sourcing strategy
- Site selection process (jointly with interface manager)
- Lead project governance, including:
- Overall project summaries
- Stoplight reporting
- Regular reviews per OSAT site
✅ 2. Supporter (Execution & Project Delivery)
- Support NPI & NTI projects executed at external OSAT factories
- Ensure OSAT compliance with:
- Development processes
- Required documentation/templates
- Drive alignment on SME (Subject Matter Expert) assignment at OSAT
- Support and resolve technical and project issues on-site and across time zones
- Ensure assembly readiness and safe production launch
🔹 Stakeholder Collaboration
You will work closely with cross-functional teams, including:
- Project Leaders & Development Managers
- Designers & Materials Engineers
- Tech Integration & Modelling teams (Electrical, Mechanical, Thermal)
- API and WLP/PLP/FC SMEs
- OSAT partners
🔹 What We’re Looking For
- Strong experience in semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding). Previous exposure to OSAT ecosystem is an added advantage.
- Proven ability to manage cross-site, cross-functional projects
- Solid understanding of NPI/NTI development flows
- Excellent stakeholder management and communication skills
- Ability to drive standardization, governance, and technical problem-solving
🌟 Why Join Us
- Opportunity to lead high-impact package innovation initiatives
- Work with global teams and OSAT partners for wide exposure and fast knowledge & skill growth
- Drive technology roadmap and next-generation packaging solutions
Key Skills
Semiconductor packagingAssembly processWire bondingOSAT ecosystemNPI developmentNTI developmentProject managementStakeholder managementTechnical problem-solvingStandardizationGovernanceCross-functional collaborationTechnology roadmapCapability assessmentCommunication skills
Categories
EngineeringManufacturingTechnology
Job Information
📋Core Responsibilities
The engineer will lead external package innovation initiatives and manage OSAT-wide development activities from concept through production. They are responsible for defining development standards, maintaining technology roadmaps, and ensuring project execution compliance at external sites.
📋Job Type
full time
📊Experience Level
5-10
💼Company Size
22537
📊Visa Sponsorship
No
💼Language
English
🏢Working Hours
40 hours
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