JOB DETAILS
Semiconductor Packaging Engineer
CompanyNXP Semiconductors
LocationTianjin
Work ModeOn Site
PostedAugust 12, 2026
About The Company
We anticipate tomorrow’s needs—navigating a changing world by bringing together technology's brightest minds to build game-changing solutions that propel us forward.
NXP Semiconductors N.V. (NASDAQ: NXPI) is the trusted partner for innovative solutions in the automotive, industrial & IoT, mobile, and communications infrastructure markets. NXP's "Brighter Together" approach combines leading-edge technology with pioneering people to develop system solutions that make the connected world better, safer, and more secure. The company has operations in more than 30 countries and posted revenue of $12.61 billion in 2024. Find out more at www.nxp.com.
Career Development Opportunities : Bright Minds. Bright Futures.
We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills.
Commitment At NXP.
We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress. Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality.
Privacy Policy: https://www.nxp.com/company/about-nxp/privacy-policy-for-social-media-pages:PRIVACY-POLICY-SOCIAL-MEDIA
About the Role
Job Description:
- Understand the semiconductor market and translate market requirements to packaging effectively. Responsible for the design, development, execution, and implementation of packaging product, structures, or assembly process technologies. Address and solve materials and processing issues that may occur during the development process.
- Develop solutions by working closely with Package Innovation teams including Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing.
- Familiar with project management by using industry standard project management tools.
- Collaborate with NXP internal assembly sites and OSATs to qualify product package solutions.
- Investigate the feasibility of emerging technologies and capabilities to potential semiconductor packaging and assembly process. Then, effectively develop or design the implementation of these into manufacturing.
- Maintain substantial knowledge of state-of-the-art principles and theories and may contribute to scientific literature and conferences. May also participate in development of patent applications.
- May involve international travel to package assembly sites and NXP suppliers.
Qualifications:
- M.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering or Electrical Engineering
- Team player with positive attitude, self-driven, with excellent communication and presentation skills (both written and verbal) are required.
- Knowledge of various IC packages like QFP, QFN, BGA, FCBGA, FCCSP, WLCSP and FOWLP is a plus.Knowledge of Statistical Analysis and Design of Experiment is a plus.
- Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.
Key Skills
Semiconductor PackagingProduct DesignAssembly Process TechnologyProject ManagementMaterials ScienceMechanical EngineeringElectrical ModelingThermal ModelingMechanical ModelingStatistical AnalysisDesign of ExperimentIC PackagingQFPQFNBGAFOWLP
Categories
EngineeringManufacturingTechnologyScience & Research
Job Information
📋Core Responsibilities
Responsible for the design, development, and implementation of semiconductor packaging products and assembly process technologies. Collaborates with internal teams and OSATs to qualify solutions and investigate emerging packaging technologies.
📋Job Type
full time
📊Experience Level
5-10
💼Company Size
22543
📊Visa Sponsorship
No
💼Language
English
🏢Working Hours
40 hours
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